RF and Microwave Microelectronics Packaging II
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Product details
| Management number | 231604442 | Release Date | 2026/06/18 | List Price | US$47.52 | Model Number | 231604442 | ||
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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. Read more
| ISBN10 | 3319516965 |
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| ISBN13 | 978-3319516967 |
| Edition | 1st ed. 2017 |
| Language | English |
| Publisher | Springer |
| Dimensions | 6.14 x 0.64 x 9.21 inches |
| Item Weight | 1.12 pounds |
| Print length | 188 pages |
| Publication date | March 22, 2017 |
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